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SmartDV Charts Course Toward Chiplets, Joins Universal Chiplet Interconnect Express (UCIe)

SmartDV™ Technologies, leading supplier of semiconductor design and verification intellectual property (IP), is exploring the future of IP and chiplets through membership in Universal Chiplet Interconnect Express (UCIe), an open industry standard organization established to define the interconnect among chiplets and further the development of chiplet design. UCIe announced its founding in March 2022; in May, SmartDV was accepted into the consortium as a contributor member.

Chiplets are at the forefront of discussion across the semiconductor industry today, with companies of all sizes and disciplines exploring ways to engage with this burgeoning technology. “At SmartDV, we recognize that chiplet technology is an important market trend that has the potential to dramatically change the face of chip design—and, with it, the IP landscape,” observed Deepak Kumar Tala, managing director of SmartDV. “We are actively seeking partnerships for continued research and development, and our membership in UCIe is a key facet of this exploration.”

To learn more about Universal Chiplet Interconnect Express, visit https://www.uciexpress.org.

Exploring Partnerships
SmartDV urges companies interested in partnering around the development of chiplet technology to reach out via email at chiplets@smart-dv.com to schedule an exploratory meeting. Additionally, SmartDV’s technical experts will be available for face-to-face discussions at the following conferences:

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