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World’s Biggest Chip Design Technology Users Event Reopens Live in Silicon Valley
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Why Multi-Die Systems Will Become Mainstream in 2023
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4 Ways the Electronics Industry Can Shape a More Sustainable World
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Synopsys Posts Financial Results for First Quarter Fiscal Year 2023
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How New Systems of Chips Take Us from Smart to Smarter
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AI-designed Chips Reach Scale with First 100 Commercial Tape-outs Using Synopsys Technology
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What’s in Store for Electronic Design in 2023?
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Synopsys Posts Financial Results for Fourth Quarter and Fiscal Year 2022
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Synopsys Appoints Shelagh Glaser Chief Financial Officer
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Synopsys Wins Six Partner of the Year Awards at TSMC 2022 OIP Ecosystem Forum
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Synopsys Research Finds Vulnerabilities in 95% of Applications, 25% Impacted by Critical- or High-Risk Vulnerabilities
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Synopsys, Ansys and Keysight Accelerate 5G/6G SoC Designs with New mmWave Reference Flow for TSMC Process Technology
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Synopsys Collaborates with TSMC to Unleash System Innovation with Most Comprehensive Multi-Die Design Solutions for TSMC’s Advanced Technologies
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Synopsys Advances Designs on TSMC N3E Process with Production-Proven EDA Flows and Broadest IP Portfolio for AI, Mobile and HPC Applications
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Synopsys Unveils Breakthrough Golden Signoff ECO Solution, Delivering 10x Productivity Improvement
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