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Synopsys and Amazon Announce Strategic, Multi-year IP Agreement for Custom Silicon; Collaboration Also Extends to Cloud and AI-Powered Engineering
OpenAI and Synopsys Announce GPT-Synopsys: Frontier Intelligence to Revolutionize Chip Design
Synopsys Powers Autonomous Engineering with a Broad Portfolio of Long-Horizon Agents and Autopilot Platform
Synopsys and TSMC Partner to Accelerate AI Systems Innovation with Agentic AI and Advanced Design
From Gate‑All‑Around to Complementary FETs: What’s Next in Transistor Scaling
Synopsys Posts Financial Results for Third Quarter Fiscal Year 2026
Accelerate AI Design from Silicon to Systems: Building for the Physical AI Era
CXL 4.0 Arrives – Synopsys Unlocks the Next Leap in AI-Scale Memory Connectivity
Synopsys and Intel Foundry Fast-Track Customer Readiness from Silicon to Systems on Intel 14A
Synopsys Advances Agentic AI Chip Design with AMD and Microsoft
Synopsys Demonstrates Leadership in AI-Powered Engineering at 2026 DAC Chips to Systems Conference
Synopsys Showcases Comprehensive Autonomous Engineering Workflows from Silicon to Systems, Developed with NVIDIA Technology
Synopsys Enables AMD Instinct™ MI455X GPU Design with Comprehensive Multi-Die Solution
From Overdesign to Co-Design: Confronting Multiphysics Challenges in Chips
Enabling the Next Generation of AI Infrastructure with Ethernet for Scale-Up Networking (ESUN)