Synopsys
World’s Biggest Chip Design Technology Users Event Reopens Live in...
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World’s Biggest Chip Design Technology Users Event Reopens Live in Silicon Valley
Why Multi-Die Systems Will Become Mainstream in 2023
4 Ways the Electronics Industry Can Shape a More Sustainable World
Synopsys Posts Financial Results for First Quarter Fiscal Year 2023
How New Systems of Chips Take Us from Smart to Smarter
AI-designed Chips Reach Scale with First 100 Commercial Tape-outs Using Synopsys Technology
What’s in Store for Electronic Design in 2023?
Synopsys Posts Financial Results for Fourth Quarter and Fiscal Year 2022
Synopsys Appoints Shelagh Glaser Chief Financial Officer
Synopsys Wins Six Partner of the Year Awards at TSMC 2022 OIP Ecosystem Forum
Synopsys Research Finds Vulnerabilities in 95% of Applications, 25% Impacted by Critical- or High-Risk Vulnerabilities
Synopsys, Ansys and Keysight Accelerate 5G/6G SoC Designs with New mmWave Reference Flow for TSMC Process Technology
Synopsys Collaborates with TSMC to Unleash System Innovation with Most Comprehensive Multi-Die Design Solutions for TSMC’s Advanced Technologies
Synopsys Advances Designs on TSMC N3E Process with Production-Proven EDA Flows and Broadest IP Portfolio for AI, Mobile and HPC Applications
Synopsys Unveils Breakthrough Golden Signoff ECO Solution, Delivering 10x Productivity Improvement
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