Electronics are everywhere, across all industries: What does that mean for 2024 and beyond?
Raising Innovation to the Cloud
Altair Otis
Embracing Multi-Die Systems and Photonics for Aerospace and Government Applications
synopsys blog multi die 3d chip
Speeding up CAE For Agriculture
Altair HPC_Customer Story_EscortsKubota
Simulating Supernovas in 3D
Altair Simulating Supernovas in 3D
Tracking Virus Variants With AI
Argonne Virus Variants
Industry Outlook 2023: Four IC design megatrends to watch
Joe Sawicki
Rambus IP Solution Supports New NIST Lightweight Cryptography Algorithm
Rambus Cryptography
Why Multi-Die Systems Will Become Mainstream in 2023
Synopsys EDA Predictions
4 Ways the Electronics Industry Can Shape a More Sustainable World
How New Systems of Chips Take Us from Smart to Smarter
Synopsys systems-of-chips
What’s in Store for Electronic Design in 2023?
Synopsys EDA Predictions
What’s Really Behind the Adoption of eFPGA?
Flex Logix Blog
SmartNICs Drive Greater Efficiency in Data Centers
Synopsys Blog data center
Taking eFPGA Security to the Next Level
Flex Logix Application Security